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 | | Integrated Interconnect Technologies for 3D Nanoelectronic Systems by Muhannad S. Bakir, James D. Meindl 528 Pages, Published 2009 by Artech House ISBN-13: 978-1-59693-247-0, ISBN: 1-59693-247-3 |
 | | Handbook of 3D Integration, Volume 4(1st Edition) Design, Test, and Thermal Management by Paul D. Franzon, Muhannad S. Bakir, Philip Garrou, Mitsumasa Koyanagi, Peter Ramm, Eric J. Marinissen, Erik Jan Marinissen Hardcover, 488 Pages, Published 2019 by Wiley-Vch ISBN-13: 978-3-527-33855-9, ISBN: 3-527-33855-1 |
 | | Handbook of 3D Integration by Paul D. Franzon, Erik Jan Marinissen, Muhannad S. Bakir 582 Pages, Published 2019 by John Wiley & Sons ISBN-13: 978-3-527-69706-9, ISBN: 3-527-69706-3 |
 | | Integrated Interconnect Technologies for 3d Nanoelectronic Systems .(1st Edition) by Muhannad S. Bakir , James D. Meindl , Artech House Publishers Hardcover, 528 Pages, Published 2009 by Artech House Publishers ISBN-13: 978-1-59693-246-3, ISBN: 1-59693-246-5 |
Muhannad Bakir
