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 | | Reliability & Failure of Electronic Materials & Devices by Milton Ohring ISBN-10: 0125249853 ISBN-10: 0-12-524985-3 ISBN-13: 9780125249850 ISBN-13: 978-0-12-524985-0 Hardcover 1998-06-15 Academic Press Find Lowest Price |
Editorials | ||
Product Description Suitable as a reference work for reliability professionals or as a text for advanced undergraduate or graduate students, this book introduces the reader to the widely dispersed reliability literature of microelectronic and electronic-optional devices. Reliability and Failure of Electronic Materials and Devices integrates a treatment of chip and packaging level failures within the context of the atomic mechanisms and models used to explain degradation, and the statistical handling of lifetime data. Electromigration, dielectric radiation damage and the mechanical failure of contacts and solder joints are among the failure mechanisms considered. An underlying thread of the book concerns product defects--their relation to yield and reliability, the role they play in failure, and the way they are experimentally exposed. The reader will gain a deeper physical understanding of failure mechanisms in electronic materials and devices, acquire skills in the mathematical handling of reliability data, and better appreciate future technology trends and the reliability issues they raise. Key Features * Discusses reliability and failure on both the chip and packaging levels * Handles the role of defects in yield and reliability * Includes a tutorial chapter on the mathematics of reliability * Focuses on electromigration, dielectric breakdown, hot-electron effects, electrostatic discharge, corrosion, radiation damage and the mechanical failure of packages, contacts, and solder joints * Considers defect detection methods and failure analysis techniques | ||
Reviews | ||
Reliability & Failure of Electronic Materials & Devices This order was completed just fine. Delivery was prompt and it arrived in good condition. No complaints. | ||
A true textbook, rather than a handbook, on reliability I have a filing cabinet full of papers on various aspects of materials reliabilty: solder stress calculations, mechanical behavior, diffusion, corrosion mechanisms, etc. Professor Ohring's book neatly summarizes all of that into one coherent text, covering topics such as electromigration, electrostatic discharge, solder mechanics, corrosion, semiconductor devices and more. But rather than touch on the practical aspects of these failure modes, as do several reliability books I already own, he delves into the underlying fundamental mechanisms involved, providing equations and explanations. This is why I consider Ohring's book a true textbook on the subject. The detailed explanations are valuable to me in that they provide a springboard from which to analyze more complex issues. For anyone involved with reliability of materials in electronics, I highly recommend this book. And one more thing: in some places Prof. Ohring writes with a refreshing informality. For example, he talks about defects and KILLER DEFECTS (his words and capitalization!). I just laughed when I saw that. | ||
Highly Recommendable The book is an excellent summary on the topic and more! It provides excellent coverage of state-of-the-art production techniques and the influence of particular procedures and components on device reliability. I suppose that complete newcomers might find it sometimes difficult to understand the background of some contents due to the compact style. However they are rewarded with one of the most comprehensive and up-to-date texts I have ever seen on this subject. Moreover the reader is provided with many references for further in-depth reading. Considering the wealth of information the book provides the author did an excellent job in writing a well readable text. I would recommend it as a textbook as well as for the experienced scientist/researcher. | ||
Excellent review on device reliability and failure analysis This book gives the basic and latest issues in the semiconductor device reliability as well as issues that nails the failure analysts. This book covers all the major issues, including oxide reliability, ESD and electromigration. This book will be and should be considered for the aspring Rel and FA engineers as well as act as a refresher to those hardcore professionals. | ||