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Proceedings of the 1997 1st Electronic
Packaging
Technology
Conference
by
Electronic
Packaging
Technology
Conference (1st : 1998 :
Singapore
)
,
Packaging
&
Manufacturing
Technology
Society
.
Singapore
Chapter
Components
(Corporate Author)
,
Andrew A. O. Tay (Editor)
Paperback
, 319 Pages
, Published 1997 by Institute of Electrical & Electronics Enginee
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Proceedings of the Seventh Annual IEEE International Conference on Wafer Scale Integration, 1995
by
Calif.) International Conference on Wafer Scale Integration (7th : 1995 : San Francisco
,
Packaging
&
Manufacturing
Technology
Society
.
Singapore
Chapter
Components
(Corporate Author)
,
Stuart K. Tewksbury (Editor)
,
Glenn Chapman (Editor)
Hardcover
, 382 Pages
, Published 1995 by Ieee
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