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Proceedings of the 1997 1st Electronic Packaging Technology Conference
by Electronic Packaging Technology Conference (1st : 1998 : Singapore), Packaging & Manufacturing Technology Society. Singapore Chapter Components (Corporate Author), Andrew A. O. Tay (Editor)
Paperback, 319 Pages, Published 1997 by Institute of Electrical & Electronics Enginee

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Proceedings of the Seventh Annual IEEE International Conference on Wafer Scale Integration, 1995
by Calif.) International Conference on Wafer Scale Integration (7th : 1995 : San Francisco, Packaging & Manufacturing Technology Society. Singapore Chapter Components (Corporate Author), Stuart K. Tewksbury (Editor), Glenn Chapman (Editor)
Hardcover, 382 Pages, Published 1995 by Ieee

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