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|  | | Electronic Packaging: Design, Materials, Process, and Reliability (1st Edition)
by John H. Lau, C.P. Wong, J.L. Prince
Hardcover, 496 Pages, Published 1998 by McGraw-Hill Professional, 1st Edition
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|  | | Micro- and Opto-Electronic Materials and Structures: Physics, Mechanics, Design, Reliability, Packaging: Volume Materials Physics / Materials Mechanics. ... Physical Design / Reliability and Packaging (1st Edition)
by Ephraim Suhir, Ephraim Suhir; Y.C. Lee; C.P. Wong (Editor)
Hardcover, 1530 Pages, Published 2007 by Springer, 1st Edition
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|  | | Polymers for Electronic & Photonic Application
by C. P. Wong
Hardcover, 661 Pages, Published 1992 by Academic Press
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|  | | Materials for Advanced Packaging (1st Edition)
by Daniel Lu (Editor), C.P. Wong (Editor)
Hardcover, 710 Pages, Published 2008 by Springer, 1st Edition
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|  | | Electronics Manufacturing : with Lead-Free, Halogen-Free, and Conductive-Adhesive Materials (1st Edition)
by John H. Lau, C.P. Wong, Ning-Cheng Lee, Ricky S.W. Lee
Hardcover, 700 Pages, Published 2002 by McGraw-Hill Professional, 1st Edition
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|  | | The Fermi Surface (Monographs on the Physics & Chemistry of Materials)
by A.P. Cracknell, K.C. Wong
Hardcover, 578 Pages, Published 1973 by Oxford University Press
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|  | | 39th Electronic Components and Technology Conference 1989 Proceedings
by Douglas H. Loescher (Introduction), C.P. Wong (Introduction)
Paperback, Published 1989 by IEEE/EIA
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|  | | Clinical Reproductive Endocrinology & Infertility Vol.2
by P.C. Wong
Paperback, Published 1990 by Excerpta Medica Asia Pacific Congress Series No.128
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|  | | Learning to recognize speakers of a non-native language: Implications for the functional organization of human auditory cortex [An article from: Neuropsychologia]
by T.K. Perrachione, P.C.M. Wong
Digital, Published 2007 by Elsevier
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|  | | Discovering ''title-like'' terms [An article from: Information Processing and Management]
by C.W.Y. Wong, R.W.P. Luk, E.K.S. Ho
Digital, Published by Elsevier
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